创芯未来 共筑生态：2023中国临港国际半导体大会将于11月23日在上海临港隆重举行

09:40-09:45

大会致辞
Guests Remarks

09:45-10:00

临港新片区集成电路产业布局及未来发展规划
Layout and Future Development Plan of Semiconductor Industry in Lin-Gang Special Area

10:00-12:00

智能化助力半导体产业发展
Intelligence Helps the Development of Semiconductor Industry

魏少军博士,中国半导体行业协会IC设计分会理事长，清华大学集成电路学院教授
Dr. Wei Shaojun, President, IC Design Branch of CSIA, Professor of TsingHua University

郑 力，长电科技董事兼首席执行长
Zheng Li，JCET CEO

半导体制程技术发展趋势
The trend of semiconductor process technologies

陈平博士, 台积电(中国)有限公司副总经理
Dr.Peter Chen, Vice President of TSMC China

杨帆, 商汤科技联合创始人、大装置事业群总裁
Yang Fan Co-founder, President of SenseCore Group of SenseTime

5G+AI融合创新助力构建万物智能互联世界
Powering the smart, connected future with 5G and AI

孙 刚，高通公司全球副总裁
Gang Sun, Qualcomm Global Vice President

开放协作，加速半导体行业数智化
Driving the Intelligent Upgrade of the Semiconductor Industry through Digital Transformation

王剑伟,华为智能制造部 总经理/部长
Wang Jianwei, General Manager of Huawei Intelligent Manufacturing Dept.

12:05-13:50

午休交流

时间

议程

13:50-14:10

车规芯片供应链现状与优化
Status quo & optimization of automotive IC supply chain

卢万成，联合汽车电子副总工程师
Lu Wancheng, Vice Chief Engineer, UEAS

14:10-14:30

基于硅基及碳化硅基的最新一代国产化功率半导体器件性能对比及分析
Performance Comparison and Analysis of the Latest Generation of Domesticated Power Semiconductor Devices Based on Silicon and Silicon Carbide

王学合，上海芯华睿半导体科技有限公司CEO
Xuehe Wang, Founder and CEO, Hua Semiconductor Co.,Ltd

14:30-14:50

功率半导体的碳化硅时代
The Future Has Arrived: The Era of SiC for Power

和巍巍，基本半导体总经理
Weiwei He，BASiC GM

14:50-15:10

域控制系统在智能汽车体系结构的应用
Zone Controllers for Intelligent Vehicle Architecture
Ladislav Varga，General Manager China，VP sales Asia，Isabellenhuette

15:10-15:30

茶歇

15:30-15:50

全“芯”助力——7nm高算力SoC打造汽车“第三空间”
SiEngine’s world-leading 7nm SoC——Empower cars to be the“Digital Third Space”

孙东，芯擎科技战略业务发展副总裁
Dong Sun, Vice President of Strategic Business Development, SiEngin

15:50-16:10

汽车芯算力，车载融合计算IP平台助力新智驾未来
Integrated Computing IP Platform Empowers Smart Car Chips

曾霖，安谋科技汽车业务线业务发展与方案总监
Director, Auto BD&Solution, Auto Line of Business, Arm China

16:10-16:30

车规芯片的可靠性认证
SEMI Reliability Assurance in the Automotive Industry

朱炬 ，SGS 中国半导体 实验室 首席技术官
James Zhu，Asia-Pacific Regional Technical Manager

16:30-16:50

技术颠覆如何驱动汽车半导体未来
How Technology Disruption is Driving the Future of the Automotive Semiconductor Sector

刘健森，Canalys 首席分析师
Jason Low, Canalys Principal Analyst

16:50-17:30

圆桌讨论：
化合物半导体如何与新能源汽车相互促进和协同发展？
How do compound semiconductors promote and synergize the development of new energy vehicles?

嘉宾：
高巍，蓉矽半导体副总经理、研发中心总经理
Dr. Aaron Gao，Vice President / GM of R&D and Engineering Center in Novus Semiconductors Co.,Ltd
刘波，威睿能源电驱业务电驱产品总监
Liu Bo, Electric Drive Products Director of VREMT Electric Drive Business
傅玥，芯干线科技董事长
Yue Fu, CEO of X-IPM
张龙，AOS产品应用中心总监
Alfred Zhang，Application Engineering Director of AOS
马彪，上海澜芯半导体创始人兼总经理
Biao Ma, CEO of Shanghai Lanxin Power Semiconductor Co.,Ltd

时间

议程

13:50-14:15

封测产业发展现状与趋势
Current Situation and Trends of the Development of Packaging and Testing Industry

徐冬梅，中国半导体行业协会副秘书长兼封测分会秘书长
Dong Mei·Xu, Deputy Secretary-General For China Semiconductor Industry Association & Secretary-General For China Semiconductor Industry Association Packaging and Testing Branch

14:15-14:40

先进封装在汽车领域的应用及发展趋势
Application and Trend of Advanced Package in Automotive

郑刚，长电汽车电子事业部副总裁，总经理兼长电汽车电子上海有限公司总经理
Jung Gang, VP /GM of JCET Auto BU VP, GM; GM of JCET Automotive Shanghai Co., ltd

14:40-15:05

后摩尔时代Chiplet热仿真技术探讨
The thermal simulation technology with post Moore law era

徐   刚，芯瑞微（上海）电子科技有限公司常务副总裁
Gavin Hsu , Executive Vice President of PhySim (Shanghai) Electronic Technology Co., Ltd

15:05-15:30

茶歇

15:30-15:55

互联定义计算，计算范式演变的关键技术
Interconnection: The Key to the Next Computing Paradigm

祝俊东，奇异摩尔产品及解决方案副总裁
Jundong Zhu, Products and Solutions, VP, Kiwimoore (Shanghai) IC Co., Ltd

15:55-16:20

EDA使能3DIC Chiplet 先进封装设计
EDA Enable 3DIC Chiplet Advanced Package Design

代文亮，芯和半导体联合创始人兼高级副总裁
Dr. Dai Wenliang，Co-Founder, SVP of Xpeedic

16:20-16:45

芯原Chiplet平台与SiP解决方案
VeriSilicon Chiplet Platform with SiP Solution

陈银龙，芯原芯片定制事业部封装工程副总裁
Yinlong Chen, Package Engineering VP, CSPD, VeriSilicon

16:45-17:30

圆桌讨论：
先进封装能否延续摩尔定律的持续有效性？
Can advanced packaging continue the continuous validity of Moore's Law?

嘉宾：
祝俊东，奇异摩尔产品及解决方案副总裁
代文亮，芯和半导体联合创始人兼高级副总裁
陈银龙，芯原芯片定制事业部封装工程副总裁
徐  刚，芯瑞微（上海）电子科技有限公司常务副总裁

时间

议程

13:50-14:15

回归AI计算第一性原理，存算一体迎大模型时代
Returning to the First Principles of AI Computing, CIM Empowers LLM Development

熊大鹏博士，亿铸科技创始人、董事长兼CEO
DAPENG XIONG, CEO of Yizhu Technologies

14:15-14:40

多模态AI终端芯片
Multimodal AI Terminal Chip

许达文博士，视海芯图创始人、董事长
Dr. Xu Dawen, Founder and Chairman of Seehi

14:40-15:05

高性能计算IP“三件套”：HBM/DDRn、Chiplet、SerDes
Highlighted HPC IP: HBM/DDRn、Chiplet、SerDes

高专，芯动科技IP研发副总裁
Zachary Gao, Vice President of IP Development，Innosilicon

15:05-15:30

茶歇

15:30-15:55

多精度存内计算在片上训练的应用与展望
Multi-Precision Design of Porcessing-In-Memory for On-Chip Training

章尧君，苹芯科技CTO
Yaojun Zhang，CTO of Pimchip Technology

15:55-16:20

智能世界展望：从高性能计算到大模型
Intelligent World Outlook: From High Performance Computing to Large Models

孙磊，华为制造与大企业军团 行业解决方案总监
Sun Lei, Semiconductor Solution Director of HUAWEI Enterprise

16:20-16:45

AI是否能驱动芯片产业链变革？
Can AI drive the transformation of the Chipset value chain?

管震，AI4C应用研究院院长
Guan Zhen，AI4C Application Research Institute CEO

16:45-17:30

圆桌讨论：
生成式AI应用的爆发对AI芯片带来哪些机会和挑战？
What opportunities and challenges does the explosion of generative AI applications bring to AI chips?

嘉宾：
熊大鹏博士，亿铸科技创始人、董事长兼CEO
高专，芯动科技IP研发副总裁
章尧君，苹芯科技CTO
管震，AI4C应用研究院院长